multilayer ceramic chip capacitors 1 of 3 creation date : november 28, 2017 (gmt) C1608X7R1H103M080AE tdk item description c1608x7r1h103mt***s applications commercial grade please refer to part no. cga3e2x7r1h103m080ae for automotive use. feature soft soft termination series c1608 [eia 0603] status production size length(l) 1.60mm +0.20,-0.10mm width(w) 0.80mm +0.15,-0.10mm thickness(t) 0.80mm +0.15,-0.10mm terminal width(b) 0.20mm min. terminal spacing(g) 0.30mm min. recommended land pattern (pa) 0.70mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pb) 0.80mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pc) 0.60mm to 0.80mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) electrical characteristics capacitance 10nf 20% rated voltage 50vdc temperature characteristic x7r(15%) dissipation factor (max.) 3% insulation resistance (min.) 10000m other soldering method wave (flow) re?ow aec-q200 no packing punched (paper)taping [180mm reel] package quantity 4000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : november 28, 2017 (gmt) C1608X7R1H103M080AE characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance C1608X7R1H103M080AE esr C1608X7R1H103M080AE capacitance C1608X7R1H103M080AE dc bias characteristic C1608X7R1H103M080AE temperature characteristic C1608X7R1H103M080AE(no bias) C1608X7R1H103M080AE(dc bias = 25v) ripple temperature rising C1608X7R1H103M080AE(100khz) C1608X7R1H103M080AE(500khz) C1608X7R1H103M080AE(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : november 28, 2017 (gmt) C1608X7R1H103M080AE associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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